Streamline Your Production Journey: SUNTECH Offers Comprehensive HDI PCB Manufacturing Services, from Design to Mass Production, for Faster Time-to-Market and Cost Savings.
At SUNTECH, we're dedicated to delivering cutting-edge HDI (High-Density Interconnect) PCB solutions that redefine industry standards. Our HDI PCBs are meticulously engineered to meet the demands of today's high-performance applications, offering unparalleled reliability, precision, and efficiency.
Unmatched Performance:Our HDI PCBs are designed to optimize signal integrity, reduce electrical noise, and ensure seamless connectivity, even in the most demanding environments.
Advanced Technology: Leveraging state-of-the-art manufacturing processes and materials, our HDI boards feature ultra-fine traces, microvias, and blind/buried vias, enabling higher circuit density and greater design flexibility.
Compact Design:With HDI technology, we can pack more functionality into smaller form factors, allowing for sleeker, more lightweight electronic devices without compromising performance.
Reliability:Backed by rigorous testing and quality assurance measures, our HDI PCBs deliver exceptional reliability and longevity, ensuring peace of mind for your critical applications.
Aerospace and Defense
Automotive
Telecommunications
Consumer Electronics
Medical Devices
Industrial Automation
At SUNTECH, customer satisfaction is our top priority. We work closely with our clients to understand their unique requirements and provide tailored solutions that exceed expectations. From prototype to production, our experienced team is here to support you every step of the way.
Ready to elevate your next project with our premium HDI PCB solutions? Contact us today to discuss your specific needs, request a quote, to email: sales@suntechpcba.com, or learn more about how our technology can drive innovation for your business.
Experience the future of PCB technology with SUNTECH. Your success is our mission.
| HDI PCB Production Capability | ||
| Item | Standard | Advanced |
| Max.Layer count | 30L | 32L |
| Products type | ELIC（4+2+4）、HDI | ELIC（4+2+4）、HDI |
| Min. Drill Size | 0.15mm | 0.15mm |
| Min. Laser Drill Size | 0.10mm | 0.075mm |
| Min.BGA Pitch | 0.40mm | 0.20mm |
| Impedance Control Tolerance | ± 8% | ± 5% |
| Buried Vias and Blind Vias | Yes | Yes |
| Stacked Via | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| HDI Structure | Yes | Yes |
| 1+N+1 \ 2+N+2\3+N+3 | ||
HDI Type
HDI 
