Multi-layer Printed Circuit board-- 10L PCB board

10 Layer PCB Manufacturing

10-layer PCBs are increasingly favored in industries such as satellite, GPS, and memory modules for their enhanced performance and compact design. These advanced circuit boards offer superior functionality and reliability, making them ideal for applications requiring high precision and durability.

10 Layer PCB Application

10-layer PCBs find extensive application across various industries, including preamplifiers, satellite dishes, GPS tracking devices, SAN storage systems, AC drives, GSM signal boosters, mobile broadband routers, 220V inverters, memory modules, and automotive dashboards, thanks to their versatility and reliability.

The manufacturing process for a 10-layer PCB typically involves several steps:

1. Design and Layout: Create a schematic and layout design using PCB design software, considering the complexity of routing paths for multiple layers.

2. Material Selection: Choose appropriate substrate materials, such as FR-4 or high-frequency laminates, based on the specific requirements of the PCB.

3. Inner Layer Processing: Begin by laminating several layers of core materials together with prepreg. Then, use a subtractive or additive process to etch copper traces and vias onto inner layers.

4. Bonding and Pressing: Stack the inner layers with bonding sheets and press them together under high temperature and pressure to form a solid panel.

5. Drilling: Use precision drilling machines to create holes for through-hole vias and plated through-holes (PTHs) between layers.

6. Through-hole Plating: Coat the drilled holes with conductive material, typically copper, to establish electrical connections between layers.

7. Copper Plating and Etching: Apply a thin layer of copper to the panel's surface, then selectively etch away unwanted copper to define the circuit traces and features.

8. Outer Layer Processing:Repeat the process of applying resist, exposing patterns, and etching to define the outer layer circuitry.

9. Surface Finish: Apply a surface finish, such as HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), or OSP (Organic Solderability Preservative), to protect the copper and facilitate soldering.

10. Testing and Inspection:Perform electrical testing, including continuity checks and impedance testing, to ensure the integrity of the PCB. Additionally, inspect the PCB for defects using automated optical inspection (AOI) or manual inspection methods.

11. Routing and Scoring:Cut the panel into individual PCBs using routing or scoring methods, depending on the desired board shape and requirements.

12. Final Inspection and Packaging:Conduct a final inspection to verify quality standards and package the finished PCBs for shipment.

Each step in the process requires precise execution to ensure the integrity and functionality of the final 10-layer PCB product.