6 layers PCB is widely used in compact electronics such as wearable devices, communication modules and military equipments. There are high restrict engineering requirements of manufacturing particular
6 layers PCB is widely used in compact electronics such as wearable devices, communication modules and military equipments. There are high restrict engineering requirements of manufacturing particularly in process of plating, laminating and drilling. Suntech technology has been consistent with the production and sales of PCBs, and constantly promoting and upgrading R&D and operation management. The company establishes a core team of competent people comprising of engineers, technicians and top-middle management personnel, who are equipped with the experience, technical expertise and innovative mindset.
A 6 layer PCB consists of six layers of circuit board material. It is a 4 layer PCB with 2 signal layers added between the planes. A 6 layer stack up includes six layers which are: two internal planes, two internal layers, two external layers, one layer for the ground, and one layer for the power.
A 6-layer stackup helps to restrain EMI between several layers and allows fine-pitch components with a high net count. This type of PCB improves EMI and as well as provides greater routing for high and low-speed signals. The two internal layers route high-speed signals and the two external layers route low-speed signals.
Applications of the 6-Layer PCB Stackup
The 6-layer stackup can be used in several applications based on the configuration and arrangement of the stackup. You must know that each stackup has its own unique arrangement that works for several application requirements.
Below are some of the applications you can use a 6-layer PCB stackup;
Processing industry to develop machines
Aviation industry
Medical industry for the production of medical equipment
Communication industry for the production of cell phones
Automotive industry for the construction of different parts on vehicles
| Muiltilayer PCB Production Capability | ||
| Item | Standard | Advanced |
| Max.Layer count | 30L | 32L |
| Max.Panel Size | 610*762mm | ≥4L: 1350mm*530mm |
| Min.Finished Board Thickness | 4L:0.30 mm | 0.30mm |
| Max.Finished Board Thickness | 4.00mm | 6.50mm |
| Max.Cu Thickness(Base) | 70um | 420um |
| Min. Drill Size | 0.15mm | 0.15mm |
| Min. Laser Drill Size | 0.10mm | 0.075mm |
| S/M Registration Tolerance | 0.004 | 0.0025 |
| Min.BGA Pitch | 0.40mm | 0.20mm |
| Impedance Control Tolerance | ± 8% | ± 5% |
| Buried Vias with Microvias | Yes | Yes |
| Stacked Via | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| HDI Structure | Yes | Yes |
| 1+N+1 \ 2+N+2\3+N+3 | ||
